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<h2 style="line-height:1.38;margin-top:24px;margin-bottom:5px;">About Paradromics</h2>Brain-related illness is one of the last great frontiers in medicine, not because the brain is unknowable, but because it has been inaccessible. Paradromics is building a brain-computer interface (BCI) platform that records brain activity at the highest possible resolution: the individual neuron. AI algorithms then decode this massive amount of brain-data, enabling the seamless translation of thought into treatments.Our first clinical application, the Connexus® BCI, will help people who are unable to speak, due to ALS, spinal cord injuries and stroke, to communicate independently through digital devices. However, the capabilities of our BCI platform go far beyond our first application. With the brain in direct communication with digital devices, we can leverage technology to transform how we treat conditions ranging from sensory and motor deficits to untreatable mental illness.<h2 style="line-height:1.38;margin-top:24px;margin-bottom:5px;">The Role</h2>We are looking for an exceptional scientist/engineer to bridge the gap between silicon microfabrication and complex, real-world systems. While many can build a MEMS device in a vacuum, we need someone who understands the physics of integrating those devices into heterogeneous material stacks without compromising performance.You will span the disciplines of materials physics, thermomechanical simulation, and micro-assembly and testing to solve complex challenges in wafer-level and die-level bonding. You will be the primary technical owner of the interface between our core semiconductor devices and the macro-packaging world.<h2 style="line-height:1.38;margin-top:24px;margin-bottom:5px;">Responsibilities</h2><ul><li style="list-style-type:disc;">Lead the development of novel bonding processes (wafer-to-wafer, die-to-wafer) involving dissimilar materials.</li><li style="list-style-type:disc;">Optimize protocols for various bonding processes including wafer bonding, diffusion bonding, laser bonding, and more, focusing on interface mechanics, intermetallic formation, and stress management.</li><li style="list-style-type:disc;">Use FEA tools (COMSOL, ANSYS) to model thermal dissipation and perform thermomechanical analysis in multi-material stacks.</li><li style="list-style-type:disc;">Oversee or execute cleanroom processes (lithography, deposition, etching) required to prepare surfaces for high-fidelity integration.</li><li style="list-style-type:disc;">Utilize SEM, TEM, CSAM, and mechanical pull-testing to validate bond quality and reliability under thermal cycling.</li><li style="list-style-type:disc;">Translate complex material requirements into specs for foundry partners or equipment vendors.</li><li style="list-style-type:disc;">Collaborate with Electrical Engineering and Electrode Manufacturing teams to support infrastructure and integration needs.</li><li style="list-style-type:disc;">Optimize development processes and translate them into manufacturing protocols.</li></ul><h2 style="line-height:1.38;margin-top:24px;margin-bottom:5px;">Required Qualifications</h2><ul><li style="list-style-type:disc;">Ph.D. or M.S. in Materials Science, Applied Physics, Mechanical Engineering, or Electrical Engineering.</li><li style="list-style-type:disc;">5+ years of hands-on experience in heterogeneous integration or advanced packaging.</li><li style="list-style-type:disc;">Deep expertise in the physics and chemistry of adhesion and bonding with proven experience in at least two of the following: wafer bonding (fusion, anodic, eutectic), TLP (Transient Liquid Phase) bonding, or laser-assisted bonding.</li><li style="list-style-type:disc;">A portfolio of work demonstrating the integration of silicon devices with non-silicon materials (e.g., ceramics, glass, metals, polymers, or III-V semiconductors).</li><li style="list-style-type:disc;">Proficiency in finite element analysis for thermal and structural mechanics.</li><li style="list-style-type:disc;">Hands-on cleanroom experiences, specifically regarding surface activation and planarization (CMP) for bonding.</li><li style="list-style-type:disc;">Hands-on experiences and knowledge with mechanical and electrical testing instruments, and building customized test setups.</li></ul><h2 style="line-height:1.38;margin-top:24px;margin-bottom:5px;">Preferred Qualifications</h2><ul><li style="list-style-type:disc;">Familiarity with the requirements and testing of hermetic packaging for MEMS</li><li style="list-style-type:disc;">Familiarity with methods and instruments for package and interface integrity characterization.</li><li style="list-style-type:disc;">Familiarity with polymer-to-inorganic material adhesion and testing.</li><li style="list-style-type:disc;">Experience designing micro-heaters or managing high-heat-flux devices.</li><li style="list-style-type:disc;">Background in academic labs known for microsystems (e.g., Stanford SNF/SNSF, MIT MTL, Michigan LNF).</li></ul><h2 style="line-height:1.38;margin-top:24px;margin-bottom:5px;">Why This Team?</h2>Most MEMS roles stop at the dicing saw. This role begins where the fab ends. You will be solving the "packaging gap"—the critical bottleneck in modern hardware physics. If you enjoy the challenge of making materials stick together that usually refuse to, this is your home.<h2 style="line-height:1.38;margin-top:24px;margin-bottom:5px;">Location</h2>Austin, TX (On-site)<hr>Paradromics is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, or national origin.

Senior Heterogeneous Integration Engineer

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Paradromics

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